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DESCRIPTION: DEX-170 is an epoxy resin of the BPF type, which exhibits low viscosity and high flow properties making it suitable for non-solvent (100% solid) applications such as coatings and molding. Additionally, DEX-170 possesses excellent flexibility and adhesive strength.

APPLICATIONS: DEX-170 resin is well-suited for a variety of applications, including civil engineering, electrical insulation materials, flooring, adhesives, non-solvent (100% solid) coatings, and electrical insulation.